Products and Technology - MEMS-CET Publications
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Sacrificial SiO2 Etch Release for MEMS Applications

Etching of Thermal Oxides in Low Pressure Anhydrous HF-CH3OH Gas Mixture at Elevated Temperature

Reduced Pressure Etching of Thermal Oxides in Anhydrous HF-Alcoholic Gas Mixtures

Fabrication of MEMS Devices by using Anhydrous HF Gas-Phase Etching with Alcoholic Vapor

A Comparison Between Wet HF Etching and Vapor HF Etching for Sacrificial Oxide Removal

HF Etching of Si-Oxides and Si-Nitrides for Surface Micromachining

Modeling and Characterization of Gas-Phase Etching of Thermal Oxide and TEOS Oxide using Anhydrous HF and CH3OH

Influence of Water Adsorption/Desorption Processes on the Selectivity of Vapor HF Etching
Wafer Surface Cleaning Applications

Vapor Phase SiO2 Etching and Metallic Contamination Removal in an Integrated Cluster System

Metal Removal from Silicon Surfaces with HCL Gas-Phase Cleaning

Role of UV/Chlorine Exposure during Dry Surface Conditioning before Integrated EPI Deposition Process

Removal of Polymer following Reactive Ion Etching

In Situ Vapor Phase Pregate Oxide Cleaning and its Effects on Metal-Oxide-Semiconductor Device Characteristics

Overview of Primaxx Dry Wafer Cleaning Research