Primaxx Inc. Product Range

Products and Technology - MEMS-CET Configurations and Specifications
NEW - CVE XeF₂ silicon etch release module option for Primaxx Cluster Tools The CVE module was jointly developed by Surface Technology Systems and Xactix, Inc. who have a combined experience of more than 20 years of providing XeF₂ based etch tools. The CVE module includes a novel process chamber design with an internal "sub-chamber" that drops down over the wafer to create a small, symmetrical etch environment. This design improves both uniformity and efficiency. Performance is dependent on exposed silicon area with etch rates typically 1 - 10 microns/minute and within wafer uniformites of < 5%. The CVE system can be supplied with Brooks MX-400 and MX-600 platforms which can include any combination of HF and XeF₂ modules.