Primaxx Inc. receives HF Vapor MEMS Etcher order from Fraunhofer-ISIT


Allentown, PA – September 7, 2005 – Primaxx, Inc., a leading manufacturer of MEMS and semiconductor wafer processing equipment, today announced that it has received a purchase order for an HF Vapor MEMS Etch Release System from Fraunhofer-ISIT in Itzehoe, Germany. The system will be delivered later this year, and will have the flexibility to be interfaced with an automated wafer handling system and up to 2 additional process modules as ISIT production requirements increase. The system purchased is able to process up to 3 wafers at a time with excellent within wafer, wafer to wafer, and batch to batch uniformities. Each wafer is supported on three ceramic pins, and can be easily adjusted to accommodate 100, 125, 150 or 200 mm wafers.

The Fraunhofer-Institut für Siliziumtechnologie (ISIT), Itzehoe, works on design, development and production of microelectronic components as well as on microsensors, microactuators and other components for microsystems technology.  The institute operates a comprehensive semiconductor device production line in conjunction with Vishay Semiconductor Itzehoe GmbH which is used for the production of microelectronic devices (PowerMOS) and microsystems as well as for R&D projects for new components and technological processes.  ISIT applies an ISO 9001:2000 certified quality management system for the development, qualification and production of microtechnical components. In view of current and future production and development activities for automotive industries, preparations for an additional TS 16949 certification are being pursued. Further services offered by the institute are the analysis and development of technology pertaining to the quality and reliability of electronic assemblies as well as packaging and mounting technology for microsystems, sensors and multichip modules.  The institute staff consists of about 150 employees.

Primaxx is the world leader in reduced pressure, residue-free MEMS dry etch release, a critical buried oxide etch step which “releases” the moving components of challenging MEMS device designs.  Combining anhydrous HF gas and alcohol vapor at reduced pressure provides a wide, stable process window that can address different oxide compositions and thicknesses while maintaining high selectivity to other common materials found in MEMS designs including aluminum.  The Primaxx process also eliminates stiction, a yield-killing phenomenon which can bind the moving components of MEMS devices when released with conventional wet processing technology.  Primaxx, Inc. designs, manufactures, and markets processing equipment for MEMS and semiconductors, and offers the broadest range of MEMS dry etch release products, from lab systems to multi-chambered cluster tools for high volume production. Headquartered in Allentown, Pennsylvania, Primaxx maintains sales and support centers in the United States, Europe and Asia, as well as two process development labs in Pennsylvania and one in Japan.

For more information, please contact:

Primaxx, Inc.
Paul Hammond, VP Sales
Tel: +1 (610) 336-0314 ext. 109
Fax : +1 (610) 336-0455
E-mail: phammond@primaxxinc.com
Web: www.primaxxinc.com

Fraunhofer Institut Siliziumtechnologie
Peter Merz, Abteilung Mikrosystemtechnik
Tel : +49 (04821) 174513
Fax : +49 (04821) 174690
Email : peter.merz@isit.fraunhofer.de
Web : www.isit.fraunhofer.de



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